Pure and Applied Chemistry

Pure Appl. Chem., 2010, Vol. 82, No. 6, pp. 1247-1258

http://dx.doi.org/10.1351/PAC-CON-09-10-43

Published online 2010-04-20

High-power impulse magnetron sputtering and its applications

References

• 1. O. A. Malkin. Impulsnij tok i Relaksatsija w Gaze, Atomizdat, Moscow (1974).
• 2. P. M. Tyuryukanov, I. K. Fetisov, G. V. Khodachenko. Soviet Phys., Tech. Phys. (Engl. trans. of Z. Tekh. Fiz.) 23, 923 (1978).
• 3. V. Kouznetsov, K. Macak, M. Schneider, J. U. Helmersson, I. Petrov. Surf. Coat. Technol. 122, 290 (1999). (http://dx.doi.org/10.1016/S0257-8972(99)00292-3)
• 4. A. P. Ehiasarian, R. New, W. D. Munz, L. Hultman, U. Helmersson, V. Kouznetsov. Vacuum 65, 147 (2002). (http://dx.doi.org/10.1016/S0042-207X(01)00475-4)
• 5. J. Bohlmark, M. Lattemann, J. T. Gudmundsson, A. P. Ehiasarian, Y. Aranda Gonzalvo, N. Brenning, U. Helmersson. Thin Solid Films 515, 1522 (2006). (http://dx.doi.org/10.1016/j.tsf.2006.04.051)
• 6. J. T. Gudmundsson, J. Alami, U. Helmersson. Appl. Phys. Lett. 78, 3427 (2001). (http://dx.doi.org/10.1063/1.1376150)
• 7. J. Vlcek, P. Kudlacek, K. Burcalova, J. Musil. J. Vac. Sci. Technol. A 25, 42 (2007). (http://dx.doi.org/10.1116/1.2388954)
• 8. A. Hecimovic, K. Burcalova, A. P. Ehiasarian. J. Phys. D: Appl. Phys. 41, 095203 (2008). (http://dx.doi.org/10.1088/0022-3727/41/9/095203)
• 9. A. Vetushka, A. P. Ehiasarian. J. Phys. D: Appl. Phys. 41, 015204 (2008). (http://dx.doi.org/10.1088/0022-3727/41/1/015204)
• 10. A. P. Ehiasarian, A. Vetushka, A. Hecimovic, S. Konstantinidis. J. Appl. Phys. 104 (2008).
• 11. A. P. Ehiasarian, R. Bugyi. In 47^th Annual Technical Conference Proceedings, April 2004, pp. 437–441, Society of Vacuum Coaters, San Francisco (2004).
• 12. P. E. Hovsepian, C. Reinhard, A. P. Ehiasarian. Surf. Coat. Technol. 201, 4105 (2006). (http://dx.doi.org/10.1016/j.surfcoat.2006.08.027)
• 13. A. P. Ehiasarian, J. G. Wen, I. Petrov. J. Appl. Phys. 101, 54301 (2007). (http://dx.doi.org/10.1063/1.2697052)
• 14. A. P. Ehiasarian, P. E. Hovsepian, L. Hultman, U. Helmersson. Thin Solid Films 457, 270 (2004). (http://dx.doi.org/10.1016/j.tsf.2003.11.113)
• 15. P. E. Hovsepian, A. P. Ehiasarian, A. Deeming, C. Schimpf. Plasma Process. Polym. 4, S897 (2007). (http://dx.doi.org/10.1002/ppap.200732201)
• 16. V. Sittinger, F. Ruske, C. Gerloff, W. Werner, B. Szyszka, D. J. Christie. In 49^th Annual Technical Conference Proceedings, April 2006, pp. 343–348, Society of Vacuum Coaters, Washington, DC (2006).
• 17. S. Konstantinidis, J. P. Dauchot, M. Hecq. Thin Solid Films 515, 1182 (2006). (http://dx.doi.org/10.1016/j.tsf.2006.07.089)
• 18. S. Konstantinidis, A. Hemberg, J. P. Dauchot, M. Hecq. J. Vac. Sci. Technol. B 25, L19 (2007). (http://dx.doi.org/10.1116/1.2735968)
• 19. Y. P. Purandare, A. P. Ehiasarian, P. E. Hovsepian. J. Vac. Sci. Technol. A 26, 288 (2008). (http://dx.doi.org/10.1116/1.2839855)